Thermal modeling and analysis of 3D multi-processor chips

نویسندگان
چکیده

برای دانلود باید عضویت طلایی داشته باشید

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

Thermal modeling and analysis of 3D multi-processor chips

As 3D chip multi-processors (3D-CMPs) become the main trend in processor development, various thermal management strategies have been recently proposed to optimize system performance while controlling the temperature of the system to stay below a threshold. These thermal-aware policies require the envision of high-level models that capture the complex thermal behavior of (nano)structures that b...

متن کامل

Thermal analysis of 3D associative processor

Thermal density and hot spots limit three-dimensional (3D) implementation of massively-parallel SIMD processors and prohibit stacking DRAM dies above them. This study proposes replacing SIMD by an Associative Processor (AP). AP exhibits close to uniform thermal distribution with reduced hot spots. Additionally, AP may outperform SIMD processor when the data set size is sufficiently large, while...

متن کامل

Thermal Modeling and Analysis of Three- Dimensional (3d) Chip Stacks

Title of Thesis: Thermal Modeling and Analysis of Three-Dimensional (3D) Chip Stacks Christopher Bachmann, Master of Science, 2007-09-11 Thesis Directed by: Avram Bar-Cohen and Jungho Kim Mechanical Engineering Department Three-dimensional (3D) chip architectures have garnered much research interest because of their potential to alleviate the interconnect delay bottleneck that is expected to li...

متن کامل

Thermal-aware 3D Multi-core Processor Design using Core and Level-2 Cache Placement

As integration densities continue to increase, interconnection has become one of the most important factors in determining the performance of multi-core processors. Recently, in order to reduce the delay due to interconnection, many studies have focused on the 3D multi-core processors. Compared to 2D multi-core architecture, 3D multi-core architecture gets decreased interconnection delay and lo...

متن کامل

langauge needs analysis of undergraduate business management and economics students

the aim of conducting this study was to investigate the foreign language learning needs of undergraduate economics students and business management students in faculties of social sciences of alzahra and azad naragh university. in the study, which was designed on the basis of a qualitative-quantitative basis using interviews and questionnaires, 146 female undergraduate business management as we...

15 صفحه اول

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

ژورنال

عنوان ژورنال: Integration

سال: 2010

ISSN: 0167-9260

DOI: 10.1016/j.vlsi.2010.06.002