Thermal modeling and analysis of 3D multi-processor chips
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چکیده
منابع مشابه
Thermal modeling and analysis of 3D multi-processor chips
As 3D chip multi-processors (3D-CMPs) become the main trend in processor development, various thermal management strategies have been recently proposed to optimize system performance while controlling the temperature of the system to stay below a threshold. These thermal-aware policies require the envision of high-level models that capture the complex thermal behavior of (nano)structures that b...
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ژورنال
عنوان ژورنال: Integration
سال: 2010
ISSN: 0167-9260
DOI: 10.1016/j.vlsi.2010.06.002